Key Takeaways
- Applied Materials and SCREEN Semiconductor Solutions (SCREEN SPE) have formalized a new innovation partnership at Applied’s EPIC Center in Silicon Valley.
- The collaboration focuses on co‑optimizing wafer cleaning, wet‑etch, and surface‑preparation technologies to improve yield and accelerate time‑to‑market for leading‑edge chips.
- By locating engineering teams together, the partnership aims to cut the development‑to‑production cycle by up to 50 % for next‑generation semiconductor processes.
- The effort builds on a long‑standing joint development history that includes work at Applied’s META Center in Albany, New York.
- The EPIC Center, spanning >180,000 sq ft, is the largest U.S. investment in advanced semiconductor equipment R&D and is slated to become operational in 2026.
Overview of the Partnership
Applied Materials, Inc. announced that SCREEN Semiconductor Solutions Co., Ltd. (SCREEN SPE), a group company of SCREEN Holdings, has joined the EPIC Center as its newest innovation partner. The collaboration will unite SCREEN SPE’s leadership in wafer cleaning technology with Applied’s expertise in materials engineering to devise co‑optimized process solutions for the world’s most advanced semiconductor devices. This deepening of a long‑standing joint development relationship is intended to overcome the increasingly stringent process challenges faced at leading‑edge nodes.
Importance of Wafer Cleanliness
As semiconductor devices shrink and become more complex, maintaining pristine wafer surfaces has become a critical determinant of yield, device performance, and reliability. Defects introduced during deposition, etch, or materials‑modification steps must be removed with ever‑greater precision, making advanced cleaning an essential enabler of next‑generation materials engineering. The partnership recognizes that any contaminant left on the wafer can cascade into downstream process failures, directly impacting manufacturability.
Complementary Expertise of the Partners
Applied Materials brings deep process know‑how across deposition, dry etch, and materials modification, while SCREEN SPE contributes industry‑leading capabilities in wafer cleaning, wet etch, and surface preparation. By combining these strengths, the two companies can develop end‑to‑end process solutions that address the full flow from film formation to final device activation. This integrated approach is expected to help chipmakers achieve higher yields and compress time‑to‑production for cutting‑edge products.
Leadership Perspectives
Dr. Prabu Raja, President of the Semiconductor Products Group at Applied Materials, emphasized that the EPIC Center is designed to accelerate commercialization by co‑locating and co‑innovating with partners across the semiconductor ecosystem. He noted that SCREEN SPE’s wet‑etch and surface‑preparation technologies are intertwined with virtually every process step, making their joint work vital for solving complex surface‑engineering challenges. Akihiko Okamoto, President of SCREEN SPE, echoed this sentiment, highlighting the growing importance of the interface between wet‑etch/cleaning and adjacent processes as device structures become more intricate and process windows narrow.
Historical Collaboration Foundations
The new partnership builds on an existing collaborative relationship that includes joint process development work at Applied’s Materials Engineering Technology Accelerator (META) Center in Albany, New York. At META, SCREEN SPE’s single‑wafer cleaning systems have been deployed to support pre‑ and post‑process cleaning optimization across film formation, etch, and ion implantation workflows. The EPIC Center collaboration expands the scope and scale of this relationship, allowing engineering teams to work side‑by‑side on a broader set of next‑generation challenges with faster learning cycles and tighter integration into Applied’s R&D programs.
EPIC Center Overview
Applied’s new EPIC (Equipment and Process Innovation and Commercialization) Center in Silicon Valley represents the largest-ever U.S. investment in advanced semiconductor equipment R&D. Covering more than 180,000 square feet on Applied’s Silicon Valley campus, the facility is purpose‑built to slash the time required to move breakthrough technologies from early‑stage research to full‑scale manufacturing—potentially by as much as half. The center serves as a collaborative hub where leading chipmakers, equipment and materials suppliers, and research institutions work alongside Applied’s teams to accelerate the development of next‑generation semiconductor technologies. The EPIC Center is on track to become operational in 2026.
Forward‑Looking Statements
The press release includes forward‑looking statements concerning Applied’s investment and growth strategies, the development of new materials and technologies, industry outlook, technology requirements, and expectations for the EPIC Center. These statements are subject to risks and uncertainties, including fluctuations in semiconductor demand, the ability to develop and protect innovative technologies, intellectual‑property challenges, and the success of achieving the EPIC Center’s objectives. Applied cautions that actual results may differ materially from those expressed or implied and notes that it assumes no obligation to update these forward‑looking statements.
Company Profiles
Applied Materials, Inc. (Nasdaq: AMAT) is a global leader in materials engineering solutions that underpin virtually every new semiconductor and advanced display. The company’s innovations are essential for advancing AI and accelerating the commercialization of next‑generation chips. SCREEN Semiconductor Solutions Co., Ltd. is a premier manufacturer of wafer processing equipment, holding the No. 1 global share in wafer cleaning equipment and providing a broad portfolio that includes lithography, annealing, and measurement/inspection systems. Both companies emphasize their commitment to pushing the boundaries of science and engineering to deliver material innovation that changes the world.
Contact Information
For media inquiries, Ricky Gradwohl can be reached at 408.235.4676. For financial‑community questions, Mike Sullivan is available at 408.986.7977. Additional details about Applied Materials and SCREEN SPE are available at www.appliedmaterials.com and https://www.screen.co.jp/spe/en, respectively.