Key Takeaways
- Hangsheng Electronics unveiled three core technologies for the AI‑Car era: Kongming 3.0 intelligent driving solution, DSSAD automated‑driving data recorder, and Mozi 3.0 central computing platform with Moyuan AI OS.
- Kongming 3.0’s “algorithms define the chip” philosophy cuts system cost by >30 % while delivering ASIL‑D safety, dual cooling options, and full domestic autonomy from algorithm to controller.
- DSSAD complies with GB 44497‑2024, records vehicle status, ADS commands, perception data, and driver inputs, and provides tamper‑proof, power‑loss‑protected data for liability determination and algorithm improvement.
- Mozi 3.0 fuses five domains (cockpit, intelligent driving, connectivity, vehicle control, on‑device AI) into one or two high‑performance units, raising resource utilization >3× and cutting cross‑domain latency to <3 ms; computing power ranges from 100+ to 1,000+ TOPS.
- Hangsheng’s “15th Five‑Year Plan” adopts a three‑tier business model—Core, Growth, Emerging—to cash‑flow‑fund next‑gen initiatives such as embodied intelligence and vehicle‑road‑cloud integration.
- The Suzhou Hangsheng‑Autoliv joint venture targets mass production of 13 projects by 2026, proving Hangsheng can collaborate as an equal with global Tier‑1 suppliers.
- Overseas expansion includes a Thai production base and planned European facilities via partners; the firm aims for 30 % of total revenue from abroad by 2030, stressing quality over pure cost advantage.
- Hangsheng is leveraging its automotive‑electronics expertise to enter robotics, low‑altitude economy, and micro‑grid markets, focusing on core electronics and computing foundations as preferred component supplies.
- Yang Hong identifies cabin‑driving fusion, AI breakthroughs, and a historic global‑expansion window as top opportunities, while warning against value‑price divergence and geopolitical/cultural compliance risks.
Introduction to Hangsheng’s AI‑Car Showcase
At Auto China 2026 on April 24, Shenzhen Hangsheng Electronics Co., Ltd. presented a suite of technologies aimed at defining the next generation of intelligent vehicles. The company highlighted three foundational pillars—the Kongming 3.0 intelligent driving solution, the DSSAD automated‑driving data recording system, and the Mozi 3.0 central computing platform paired with Moyuan AI OS—each designed to meet the rising demands of software‑hardware integration, safety, and computational efficiency in the AI‑Car era.
Kongming 3.0 Intelligent Driving Solution
Kongming 3.0 rests on a design philosophy where “algorithms define the chip,” enabling tight software‑hardware synergy. Hangsheng reports that this approach reduces overall system cost by more than 30 % while simultaneously boosting performance. The underlying chip incorporates a built‑in safety island that satisfies ASIL‑D functional‑safety standards, supports both air and liquid cooling, and can be deployed in internal‑combustion and electric vehicles alike. Mass production for a leading automaker is slated for September 2026. Chairman Yang Hong emphasized that the solution delivers full domestic autonomy—from core algorithms to domain controllers—resulting in lower power consumption and higher efficiency.
DSSAD Automated‑Driving Data Recording System
The DSSAD system is engineered strictly to the national GB 44497‑2024 standard, capturing a comprehensive dataset that includes vehicle operating status, automated driving system commands, environmental perception information, and driver inputs. Its automotive‑grade architecture meets ASIL‑D safety requirements and features hardware secure boot, data anti‑tampering mechanisms, power‑loss protection, and robust defenses against fire and water immersion. Hangsheng positions DSSAD as serving a dual role: providing an objective basis for accident liability determinations and supplying real‑world scenario data that fuels continuous algorithm iteration and improvement.
Mozi 3.0 Central Computing Platform with Moyuan AI OS
Mozi 3.0 adopts a “five‑domain fusion” architecture, centrally managing cockpit functions, intelligent driving, connectivity, vehicle control, and on‑device AI computing. By consolidating what traditionally required numerous scattered ECUs or domain controllers into one or two high‑performance units, the platform achieves resource utilization gains exceeding threefold and reduces cross‑domain data interaction latency to under three milliseconds. The platform is offered in a full matrix from standard to flagship editions, delivering computing power ranging from 100+ to 1,000+ TOPS to suit economy through luxury models. Accompanying Moyuan AI OS provides an AI‑driven HMI with a cross‑screen panoramic 3D interface and the HSClaw active service agent, which leverages edge‑cloud fusion large‑model capabilities to operate offline; for example, a user can ask “Where is my car?” and the system fuses positioning, surround‑view, and map data to locate the vehicle autonomously.
New‑Energy Power‑Control Technologies
Beyond the core AI‑Car stack, Hangsheng displayed dual motor controllers, integrated generator controllers, and multi‑gear, multi‑mode powertrains tailored for commercial heavy‑duty trucks. The company claims these solutions lead the industry in integration efficiency, NVH (noise, vibration, harshness) control, and energy conservation, reinforcing Hangsheng’s breadth of expertise across both passenger‑car and commercial‑vehicle domains.
Business Stratification and the “Three‑Step” Growth Plan
Hangsheng’s management outlined a three‑tier businessportfolio for the upcoming “15th Five‑Year Plan”: Core, Growth, and Emerging. Core businesses—cockpit domain controllers, intelligent driving, cabin‑driving fusion, and intelligent interaction—are intended to generate steady cash flow and technological foundations. Growth businesses encompass central computing platforms, software services, and intelligent connectivity, scaling the company’s market reach. Emerging businesses target embodied intelligence and vehicle‑road‑cloud integration, positioning Hangsheng to capture future growth avenues. Chairman Yang Hong noted that Core businesses finance Growth and Emerging initiatives, while Emerging ventures open new horizons for the next five to ten years.
Joint Venture Progress with Autoliv
A concrete manifestation of Hangsheng’s collaborative strategy is the Suzhou Hangsheng‑Autoliv Automotive Electronics Co., Ltd., inaugurated on April 16. This joint venture aims to achieve mass production for 13 projects by 2026, supplying OEMs such as Chery, Geely, Volvo, and Li Auto. Yang Hong remarked that the partnership demonstrates Hangsheng’s capability to engage as an equal with international Tier‑1 giants, fostering mutual empowerment. He expressed interest in pursuing similar deep alliances with other global partners, particularly in intelligent domain controllers and next‑generation perception systems.
Overseas Expansion Strategy
Hangsheng is already establishing a production base in Thailand and plans to set up European manufacturing facilities through local partners. Over the past two years, the firm has secured orders from major international clients, including Toyota (Southeast Asia), global Honda, global Suzuki, Stellantis, and Scania. Yang Hong stressed that global success cannot rely solely on cost advantages; maintaining a “quality‑first” bottom line is essential to transition from merely “going out” to truly “moving up.” The company targets overseas revenue to constitute 30 % of total revenue by 2030.
Diversification into Robotics, Low‑Altitude Economy, and Microgrids
Leveraging its vehicle‑electronics expertise, Hangsheng is extending into robotics, the low‑altitude economy, and micro‑grid markets. The company has formed technology and manufacturing collaborations with leading robotics manufacturers and low‑altitude‑aircraft enterprises. Yang Hong clarified that Hangsheng does not aim to do everything; instead, it concentrates on its strengths—core electronics and computing foundations—to become the preferred supplier of key components in these emerging sectors.
Opportunities and Challenges for China’s Intelligent Automotive Electronics
Looking ahead three years, Yang Hong identified three major opportunities: the value reconstruction driven by cabin‑driving fusion, the rapid advancement of AI technologies, and a historic window for Chinese automotive electronics to expand globally. Conversely, he warned of persistent challenges, including the divergence between perceived value and aggressive price wars, as well as geopolitical and cultural compliance risks when operating abroad. He urged the industry to “return to value competition and win through technology and quality, rather than sheer price warfare.”
The “1+2+N” Product Array at Auto China 2026
At the exhibition, Hangsheng showcased its “1+2+N” lineup, which covers a broad spectrum of automotive offerings—intelligent driving, intelligent connectivity, intelligent interaction, acoustic systems, and new‑energy control electronics—as well as emerging products in robotics, the low‑altitude economy, and micro‑grids. This modular approach illustrates Hangsheng’s strategy of providing a scalable foundation (“1”) complemented by two core layers (“2”) and a customizable set of niche solutions (“N”) to meet diverse customer needs across traditional and future mobility markets.